AE-Based Signal Verification for Wafer Crack Detection
[ Field Issue ]
Problem
Needs
Wafer crack/breakage events occur in extreme conditions (high heat, static)
Real-time detection of crack/breakage signs
Wafer crack directly causes defects and lower yield
Continuous monitoring for early detection & response
Equipment operates under extreme conditions (~400°C, static electricity, confined space) with high risk of wafer crack/breakage
Since cracks directly cause defects and yield loss, AE-based continuous monitoring is needed for early detection
[ Pre-Test ]
Real Process Simulation Verification
Verified crack-like events via PLB test in actual wafer-chuck environment
Confirmed micro-crack signal detection possible with frequency filtering applied
Confirmed stable crack detection performance even under high-temp & current noise conditions
AE-Based Signal Verification for Wafer Crack Detection
[ Field Issue ]
Equipment operates under extreme conditions (~400°C, static electricity, confined space) with high risk of wafer crack/breakage
Since cracks directly cause defects and yield loss, AE-based continuous monitoring is needed for early detection
Problem
Need
Wafer crack/breakage events occur in extreme conditions (high heat, static)
Real-time detection of crack/breakage signs
Wafer crack directly causes defects and lower yield
Continuous monitoring for early detection & response
[ Pre-Test ]
Real Process Simulation Verification
Verified crack-like events via PLB test in actual wafer-chuck environment
Confirmed micro-crack signal detection possible with frequency filtering applied
Confirmed stable crack detection performance even under high-temp & current noise conditions
